Waferinspection (Izm-14.1) (Pr958425-2590-P)

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 110897343

  Document Type - Tender Notices

Description - Description: Description: 1 piece: WaferinpectionThe measuring systems are used for the following tasks:- Measurement of deflection, deformation and tension of bare wafers as well as wafers with applied layers (silicon components or metal layers) on the front and/or back,- Measurement of the total thickness and TTV of naked wafers, bonded wafers, individual stacks of bonded wafers such as device or handle wafers and wafers with secluded layers that are visually thick,- Measurement of the TSV von Trenches with a high aspect ratio (at least 1:30).The system must be equipped with a sample recognition system for the wafer orientation and the alignment of the measuring point. The sample recogniti

Gt Ref Id - 110897343

Deadline - Jul 11, 2025