Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Country - United Kingdom
Summary - Supply, Delivery, Installation & Commissioning Of A Wafer Thinning Turnkey Itt
Deadline - login to view
GT reference number - 115616653
Product classification - Semiconductors
Address - United Kingdom
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 115616653
Document Type - Tender Notices
Description - Description: The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semicond uctor packaging line.The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-se
Gt Ref Id - 115616653
Deadline - Nov 30, -0001
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