Laser Plasma Dicer (Izm-25.1) (Pr889073-2590-P)

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 109634067

  Document Type - Tender Notices

Description - Description: Description: 1 laser plasma dicerThe heterogeneous integration is based on the electrical connection of different types of chips that are made at the wafer level. In order to create such systems, individual chips must be produced. As a r ule, the individual chips are cut out of the wafers after processing. A water -assisted laserdicer is necessary to cut or cut wafers from different materials with high quality. This makes it possible to separate chips from a wide range of wafer materials. Even materials that produce toxic particles in the air can be processed by cutting in a liquid. In the case of silicon or glass wafers, the laser process also enables better cut quality than cla

Gt Ref Id - 109634067

Deadline - Jun 23, 2025