Delivery Of Two Identical Advanced Surface Grinding Systems Designed Specifically For Grinding Semiconductor Substrates, Such As Gall Nitride (Gan) And Silicon Carbide (Sic).

  Address - Poland

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 110650991

  Document Type - Tender Notices

Description - Description: Please Scroll Down for the English VersionThe subject of the order is "Delivery of two identical advanced surface grinding systems designed specifically for grinding semiconductor substrates, such as gall nitride (GAN) and silicon carbid e (sic)."Purchase of two identical grinders:Requirements for the specifications of the grinders• A grinder specially designed for grinding semiconductor wafers, such as gallium nitride (GAN) and silicon carbide (sic).• Single -shaped grinding grinding grinder individually• waffle processing with a diameter of 25 mm to 150 mm• Possibility to use grinding discs from any supplierDimensions of the grinder:• base area: less than: 1.5 m (widt

Gt Ref Id - 110650991

Deadline - Jul 07, 2025