Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1)

Name: Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1)
Start: 2024-04-15
End: 2024-05-07
Location: Chengdu Yicheng Integrated Circuit Co., Ltd.

Chengdu Yicheng Integrated Circuit Co., Ltd. China has Released a tender for Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1) in Energy, Power and Electrical. The tender was released on Apr 15, 2024.

Country - China

Summary - Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1)

Deadline - May 07, 2024

GT reference number - 80764807

Product classification - Electrical apparatus for switching or protecting electrical circuits

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 80764807

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1)local title:: 奕斯伟板级封装系统集成电路项目 - 国际招标公告(1)type_of_procedure: Otherbidding_response_method: No t Available

Gt Ref Id - 80764807

Deadline - May 07, 2024

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