Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Country - United Kingdom
Summary - Wafer Dicing Saw And Post Wafer Cleaning
Deadline - May 28, 2024
GT reference number - 81299943
Product classification - Laboratory, optical and precision equipments (excl. glasses)
Address - United Kingdom
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 81299943
Document Type - Tender Notices
Description - Description: The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Tech nologies, Photonics and Advanced Manufacturing.This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge st
Gt Ref Id - 81299943
Deadline - May 28, 2024
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