Wafer Bonder-Aligner

  Address - Sweden

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 117455759

  Document Type - Tender Notices

Description - Description: KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), and quantum systems .local title:: Wafer Bonder-AlignerContract Duration: : 12 DAYContract Type: : Supplylocal description: : KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), and quantum systems.Net Budget Euro: : 10000000.0Net Budget LC: : 10000000.0 dispatch_date: 2025-09-05 00:00:00 est_amount: 10

Gt Ref Id - 117455759

Deadline - Oct 27, 2025