Supply, Delivery, Installation & Commissioning Of A Wafer Thinning Turnkey Itt

  Address - United Kingdom

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 109286073

  Document Type - Tender Notices

Description - Description: The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semicond uctor packaging line.The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-se

Gt Ref Id - 109286073

Deadline - Jun 04, 2025