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Smd_Ps_Rfq_490035 Analysis Of Lead In Dust Wipe Smples & Lead In Paint Chip Smp

NEW YORK CITY HOUSING AUTHORITY United States has Released a tender for Smd_Ps_Rfq_490035 Analysis Of Lead In Dust Wipe Smples & Lead In Paint Chip Smp in Metals and non metals. The tender was released on Oct 27, 2023.

Country - United States

Summary - Smd_Ps_Rfq_490035 Analysis Of Lead In Dust Wipe Smples & Lead In Paint Chip Smp

Deadline - login to view

GT reference number - 73681218

Product classification - Lead

Organization Details:

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 73681218

  Document Type - Tender Notices

Notice Details and Documents:

Description - Title: SMD_PS_RFQ_490035 ANALYSIS OF LEAD IN DUST WIPE SMPLES & LEAD IN PAINT CHIP SMP Agency: New York City Housing Authority Division: Supply Management Procurement Department Contract Number: 490035 CR Number: 2103122 Date of Issue: 10/27/2023 Due Date/Time: 11/29/2023 2:00 PM Proposal Submission Deadline County(ies): All NYS counties Location: Various Developments, Citywide Classification(s): Environmental - Consulting & Other Services Opportunity Type: General Description Contact Info Documents Updates Bid Results/Awards Indefinite Delivery Indefinite Quantity Contract for Analysis of Lead in Dust Wipe Samples and Lead in Paint Chip Samples, Citywide. No Bid Security Required

Gt Ref Id - 73681218

Deadline - Nov 29, 2023

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