Silicon Carbide Diamond Wire Slicing Machine - International Tender Announcement (2)

Name: Silicon Carbide Diamond Wire Slicing Machine - International Tender Announcement (2)
Start: 2024-03-19
End: 2024-04-09
Location: Beijing Tianke Heda Semiconductor Co., Ltd.

Beijing Tianke Heda Semiconductor Co., Ltd. China has Released a tender for Silicon Carbide Diamond Wire Slicing Machine - International Tender Announcement (2) in Machinery and Equipments. The tender was released on Mar 19, 2024.

Country - China

Summary - Silicon Carbide Diamond Wire Slicing Machine - International Tender Announcement (2)

Deadline - login to view

GT reference number - 79819350

Product classification - Construction structures and materials; auxiliary products to construction (except electric apparatus)

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 79819350

Document Type - Tender Notices

Notice Details and Documents:

Description - Description Silicon carbide diamond wire slicing machine - International Tender Announcement (2), local title 碳化硅金刚线切片机 - 国际招标公告(2), Global Tenders is not only confined to tenders but we also upload crucial information, from future prospects to past market records.

Gt Ref Id - 79819350

Deadline - Apr 09, 2024

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