Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Country - Austria
Summary - Silicon Austria Labs – Chips Ju: Wafer Bumper
Deadline - Sep 16, 2025
GT reference number - 116905625
Product classification - Laboratory, optical and precision equipments (excl. glasses)
Address - Austria
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 116905625
Document Type - Tender Notices
Description - Description: The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.local title:: Silicon Austria Labs – Chips JU: Wafer bumperContract Duration: : 11 MONTHContract Type: : Supplylocal description: : The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon
Gt Ref Id - 116905625
Deadline - Sep 16, 2025
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