Silicon Austria Labs – Chips Ju: High Power Impulse Magnetron Sputtering And Inductively-Coupled Plasma Etching (Hipims & Icp)

  Address - Austria

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 114388725

  Document Type - Tender Notices

Description - Description: The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron s puttering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH.local title:: Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)Contract Duration: : 6 MONTHContract Type: : Supplylocal description: : The aim of this procurement procedure is to award the contract to the best bidder ident

Gt Ref Id - 114388725

Deadline - Aug 13, 2025