Semi-Automatic Wafer Grinder

  Address - Finland

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 120651511

  Document Type - Tender Notices

Description - Description: The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 3 00 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new.The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.local titl

Gt Ref Id - 120651511

Deadline - Nov 17, 2025