Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Country - United Kingdom
Summary - Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Deadline - Aug 22, 2024
GT reference number - 70636359
Product classification - Laboratory, optical and precision equipments (excl. glasses)
Address - United Kingdom
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 70636359
Document Type - Tender Notices
Description - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to s upport a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Gt Ref Id - 70636359
Deadline - Aug 22, 2024
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