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Country - United States
Summary - Next-Generation Microelectronics Manufacturing (Ngmm) Summit
Deadline - Oct 06, 2025
GT reference number - 113392222
Product classification - Research and development consultancy services
Address - United States
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 113392222
Document Type - Tender Notices
Description - Description: The Defense Advanced Research Projects Agency (DARPA) will host the first annual Next-Generation Microelectronics Manufacturing Summit (NGMM) to convene stakeholders from across defense, academia, and industry to learn more about the pro gram and how they can utilize the capability in the future to support their research, prototyping programs, and product fabrication. Highlights include: • Inside NGMM: Early customer/partner engagement, program timeline, and ways to get involved in three-dimensional multi-material, heterogeneously integrated (3DHI) research and development (R&D) and prototyping. • Technology roadmap: Overview of 3DHI technology roadmap and design/development
Gt Ref Id - 113392222
Deadline - Oct 06, 2025
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