Nantong Kangyuan Integrated Circuit Packaging Board Project (Phase I) - 1 Laser Direct Imaging System (Secondary Bidding) - International Bidding Announcement (2)

Name: Nantong Kangyuan Integrated Circuit Packaging Board Project (Phase I) - 1 Laser Direct Imaging System (Secondary Bidding) - International Bidding Announcement (2)
Start: 2025-09-09
End: 2025-09-29
Location: Nantong Kangyuan Circuit Technology Co., Ltd.

Nantong Kangyuan Circuit Technology Co., Ltd. China has Released a tender for Nantong Kangyuan Integrated Circuit Packaging Board Project (Phase I) - 1 Laser Direct Imaging System (Secondary Bidding) - International Bidding Announcement (2) in Technology Hardware and Equipment. The tender was released on Sep 09, 2025.

Country - China

Summary - Nantong Kangyuan Integrated Circuit Packaging Board Project (Phase I) - 1 Laser Direct Imaging System (Secondary Bidding) - International Bidding Announcement (2)

Deadline - Sep 29, 2025

GT reference number - 117485358

Product classification - Optical instruments

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 117485358

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Nantong Kangyuan Integrated Circuit Packaging Board Project (Phase I) - 1 laser direct imaging system (secondary bidding) - International bidding announcement (2)local title:: 南通康源集成电路封装载板项目（一期）-激光直接成像系统1台（二次招标） - 国际招标公告(2)Document Fee: : ￥500/$100

Gt Ref Id - 117485358

Deadline - Sep 29, 2025

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