Multi-functional Integrated Cutting and Packaging System for Next-Generation Electronics and Sensing Devices

Name: Multi-functional Integrated Cutting and Packaging System for Next-Generation Electronics and Sensing Devices
Start: 2025-05-14
End: 2025-06-17
Location: Chinese University of Hong Kong

Chinese University of Hong Kong Hong Kong has Released a tender for Multi-functional Integrated Cutting and Packaging System for Next-Generation Electronics and Sensing Devices in Metals and non metals. The tender was released on May 14, 2025.

Country - Hong Kong

Summary - Multi-functional Integrated Cutting and Packaging System for Next-Generation Electronics and Sensing Devices

Deadline - Jun 17, 2025

GT reference number - 108827012

Product classification -

Organization Details:

Address - Hong Kong

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 108827012

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Multi-functional Integrated Cutting and Packaging System for Next-Generation Electronics and Sensing Deviceslocal title:: Multi-functional Integrated Cutting and Packaging System for Next-Generation Electronics and Sensing DevicesContrac t Type: : Supply

Gt Ref Id - 108827012

Deadline - Jun 17, 2025

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