In-Line Afm (Izm-15.1) (Pr990603-2590-P)

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 110575572

  Document Type - Tender Notices

Description - Description: Description: With the progress of the 2.5D/3D package and in particular with the heterogeneous integration of different materials, there are several W2W or D2W bonding technologies, namely direct, fusion or hybrid bonding, in which diffe rent materials such as SI, SIO, sin, polymer and metal can be connected, whereby the surface roughness is important. In addition, the CMP of polymer-based RDLs with high milling density requires a CMP with subsequent inline monitoring. Therefore, the inline grid power microscopy is used as a measuring instrument for surface characterization. In such cases, not only the surface roughness must be measured, but also the dishing or small projections

Gt Ref Id - 110575572

Deadline - Jul 07, 2025