Hybrid Integrated Chip Pilot Wire Inductively Coupled Plasma Etching System Of The School Of Electronics And Information Engineering, Sun Yat-Sen University-Bidding Announcement Of Gallium Indium Phosphide Procurement Project

Name: Hybrid Integrated Chip Pilot Wire Inductively Coupled Plasma Etching System Of The School Of Electronics And Information Engineering, Sun Yat-Sen University-Bidding Announcement Of Gallium Indium Phosphide Procurement Project
Start: 2025-05-22
End: 2025-06-11
Location: 中山大学

中山大学 China has Released a tender for Hybrid Integrated Chip Pilot Wire Inductively Coupled Plasma Etching System Of The School Of Electronics And Information Engineering, Sun Yat-Sen University-Bidding Announcement Of Gallium Indium Phosphide Procurement Project in Fire Safety and Security. The tender was released on May 21, 2025.

Country - China

Summary - Hybrid Integrated Chip Pilot Wire Inductively Coupled Plasma Etching System Of The School Of Electronics And Information Engineering, Sun Yat-Sen University-Bidding Announcement Of Gallium Indium Phosphide Procurement Project

Deadline - Jun 11, 2025

GT reference number - 109338978

Product classification - Detection and analysis apparatus

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 109338978

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Cargo/equipment/electrical, electronic production equipment/electronic industrial production equipmentlocal title:: 中山大学电子与信息工程学院混合集成芯片先导线电感耦合等离子体刻蚀系统-砷化镓磷化铟采购项目招标公告local description: : 货物/设备/电工、电子生产设备/电子工业生产设备Net Budget LC: : 8200000.0Document Fee: : ￥0 est_amount: 8200000.0

Gt Ref Id - 109338978

Deadline - Jun 11, 2025