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High-Precision Semiconductor Film Formation Device Set

国立大学法人 Japan has Released a tender for High-Precision Semiconductor Film Formation Device Set in Machinery and Equipments. The tender was released on Jul 11, 2025.

Country - Japan

Summary - High-Precision Semiconductor Film Formation Device Set

Deadline - Jul 26, 2025

GT reference number - 113133299

Product classification - Construction structures and materials; auxiliary products to construction (except electric apparatus)

Organization Details:

  Address - Japan

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 113133299

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Bid announcementGeneral competitive bids are included as follows:July 11, 2025ContractorToyohashi University of Technology, National University CorporationSecretary General Yamaguchi Shigeru◎Procurement agency number: 415 ◎Location n umber: 23○No. 71. Procurement details⑴ Item classification number 24⑵ Purchasing subject and quantity: High-precision semiconductor film formation device set⑶ Characteristics of the procurement subject, etc. according to the bidding instructions.⑷ Delivery deadline: February 6, 2026⑸ Delivery location: Next-generation Semiconductor and Sensor Science Research Institute, Toyohashi University of Technology, National University Corporati

Gt Ref Id - 113133299

Deadline - Jul 26, 2025

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