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Delivery Of A Device For Grinding And Polishing Semiconductor Wafers

Krajowa Izba Odwolawcza Poland has Released a tender for Delivery Of A Device For Grinding And Polishing Semiconductor Wafers in laboratory equipment and services . The tender was released on Oct 24, 2025.

Country - Poland

Summary - Delivery Of A Device For Grinding And Polishing Semiconductor Wafers

Deadline - Nov 24, 2025

GT reference number - 120853198

Product classification - Machines and apparatus for testing and measuring

Organization Details:

  Address - Poland

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 120853198

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: The subject of the order is the delivery, installation, commissioning and testing of a device for grinding and polishing semiconductor wafers, along with documentation and training.local title:: Dostawa urządzenia do szlifowania i poler owania płytek półprzewodnikowychContract Duration: : 90 DAYContract Type: : Supplylocal description: : Przedmiotem zamówienia jest dostawa, instalacja, uruchomienie i testowanie urządzenia do szlifowania i polerowania płytek półprzewodnikowych wraz z dokumentacją i szkoleniem lot_details: 1: Delivery of a device for grinding and polishing semiconductor wafers

Gt Ref Id - 120853198

Deadline - Nov 24, 2025

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