Bxinp_2024-03_Framework Agreement For The Provision Of Multi-Project Wafer Manufacturing Services (Mpw) In The Field Of Integrated Circuits For Prototyping Within The Framework Of Research And

  Address - France

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 79955727

  Document Type - Tender Notices

Description - Description BxINP_2024-03_Framework agreement for the provision of multi-project wafer manufacturing services (MPW) in the field of integrated circuits for prototyping within the framework of research and development projects of the IMS laboratory, d ispatch_date: 2024-03-20 00:00:00, local title BxINP_2024-03_Accord-cadre de prestation de services de fabrication de plaquettes multi-projet (MPW) dans le domaine des circuits intégrés pour le prototypage dans le cadre de projets de recherche et,

Gt Ref Id - 79955727

Deadline - Apr 24, 2024