Back-End-Of-Line (Beol) 4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 110953159

  Document Type - Tender Notices

Description - Description: NASA Glenn Research Center (GRC) plans to issue a Request for Proposal (RFP) for Back-End-Of-Line (BEOL) 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers. NASA is seeking fabrication of particular integrated SiC device structures (JFETs and resistors) via a particular fabrication process flow to the desired specifications on NASA-provided 100 mm diameter 4H-SiC epilayered wafers using NASA-provided device-layout design files. The Government does not intend to acquire a commercial product or commercial service using FAR Part 12. The NAICS Code and Size Standard are 541715 Research and Development in the Physical, Engineering, and Life Scien

Gt Ref Id - 110953159

Deadline - Jun 20, 2025