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Announcement On The Bidding Of Hybrid Integrated Chip Pilot Wire Plasma Enhanced Chemical Vapor Deposition-Silica Amorphous Silicon Procurement Project Of Sun Yat-Sen University School Of Electronics And Information Engineering

中山大学 China has Released a tender for Announcement On The Bidding Of Hybrid Integrated Chip Pilot Wire Plasma Enhanced Chemical Vapor Deposition-Silica Amorphous Silicon Procurement Project Of Sun Yat-Sen University School Of Electronics And Information Engineering in Fire Safety and Security. The tender was released on May 21, 2025.

Country - China

Summary - Announcement On The Bidding Of Hybrid Integrated Chip Pilot Wire Plasma Enhanced Chemical Vapor Deposition-Silica Amorphous Silicon Procurement Project Of Sun Yat-Sen University School Of Electronics And Information Engineering

Deadline - Jun 10, 2025

GT reference number - 109294432

Product classification - Detection and analysis apparatus

Organization Details:

  Address - China

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 109294432

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Cargo/equipment/electrical, electronic production equipment/electronic industrial production equipmentlocal title:: 中山大学电子与信息工程学院混合集成芯片先导线等离子体增强化学气相沉积-氧化硅非晶硅 采购项目招标公告local description: : 货物/设备/电工、电子生产设备/电子工业生产设备Net Budget LC: : 5800000.0Document Fee: : ¥0 est_amount: 5800000.0

Gt Ref Id - 109294432

Deadline - Jun 10, 2025

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