Acquisition Of Semiconductor Cutting Equipment.

Name: Acquisition Of Semiconductor Cutting Equipment.
Start: 2023-10-27
End: 2023-11-21
Location: Institut Polytechnique de Grenoble

Institut Polytechnique de Grenoble France has Released a tender for Acquisition Of Semiconductor Cutting Equipment. in Technology Hardware and Equipment. The tender was released on Oct 26, 2023.

Country - France

Summary - Acquisition Of Semiconductor Cutting Equipment.

Deadline - login to view

GT reference number - 73657509

Product classification - Microelectronic machinery and apparatus and microsystems

Organization Details:

Address - France

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 73657509

Document Type - Tender Notices

Notice Details and Documents:

Description - CIME Nanotech wishes to acquire an automatic 300mm semiconductor wafer cutting machine to complete the equipment that makes up its “hybrid cutting-assembly” workshop. This equipment will make it possible to meet a growing demand for service for c utting 300mm semiconductor wafers.

Gt Ref Id - 73657509

Deadline - Nov 21, 2023

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