Acquisition Of A Component Assembly System Using The Flip-Chip Method (Flip-Chip Bonder)

  Address - France

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 120277231

  Document Type - Tender Notices

Description - Description: Acquisition of a component assembly system using the flip-chip method (flip-chip bonder) for the needs of FEMTO-STlocal title:: Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder)Contract Typ e: : Supplylocal description: : Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder) pour les besoins de FEMTO-ST dispatch_date: 2025-10-15 00:00:00 lot_details: 1: Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)

Gt Ref Id - 120277231

Deadline - Nov 17, 2025