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A Set Of Superconducting Bonding Equipment For Large-Diameter Substrates

Name: A Set Of Superconducting Bonding Equipment For Large-Diameter Substrates
Start: 2025-07-15
End: 2025-07-30
Location: 国立研究開発法人理化学研究所

国立研究開発法人理化学研究所 Japan has Released a tender for A Set Of Superconducting Bonding Equipment For Large-Diameter Substrates in Machinery and Equipments. The tender was released on Jul 15, 2025.

Country - Japan

Summary - A Set Of Superconducting Bonding Equipment For Large-Diameter Substrates

Deadline - Jul 30, 2025

GT reference number - 113364143

Product classification - Construction structures and materials; auxiliary products to construction (except electric apparatus)

Organization Details:

Address - Japan

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 113364143

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Bid announcementGeneral competitive bids are included as follows:July 15th, 2025RIKEN National Research and Development CorporationHoshino Satoshi, Head of Procurement Department, Accounting and Procurement Headquarters◎Procurement age ncy number: 814 ◎Location number: 11○2025 No. 261. Procurement details⑴ Item classification number 24⑵ Purchasing Subject and Quantity: A set of superconducting bonding forming equipment for large-diameter substrates⑶ Characteristics of the procurement project, as shown in the bidding instructions and specifications.⑷ Delivery deadline: March 31, 2026⑸ Delivery location: RIKEN Research Institute, National Research and Development Co

Gt Ref Id - 113364143

Deadline - Jul 30, 2025