A Packaging Machine For Integrating Photonic Integrated Circuits

  Address - Switzerland

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 80766144

  Document Type - Tender Notices

Description - Description: In 2024, EPFL intends to acquire a packaging machine for the integration of photonic integrated circuits for its laboratory LPQM. The devices will be dedicated to cutting-edge research in integrated photonics and MEMS: the aim is to full y integrate photonic devices through techniques of fiber-to-chip bonding, fiber array-to-chip bonding and butterfly packaging using active alignment and in-situ testing of both optical and electro-optical properties. The system is fully automatic with an active alignment system and relies on soldering and adhesives. The packaging machine must also contain the following functionalities: see specifications.local title:: Ein Verpackungmaschine für

Gt Ref Id - 80766144

Deadline - May 20, 2024