A: A Set Of Ultrapure Water Manufacturing Equipment With High-Speed Large Area Electron Beam Exposure Device, B: Set Of Chip-To-Chip Interface Waveform Evaluation Equipment, C: Set Of Next-Generation Sequencer, D: Set Of Scanning Electron Microscope Fe-Sem+Eds, E: Gnss Signal Simulation.

Name: A: A Set Of Ultrapure Water Manufacturing Equipment With High-Speed Large Area Electron Beam Exposure Device, B: Set Of Chip-To-Chip Interface Waveform Evaluation Equipment, C: Set Of Next-Generation Sequencer, D: Set Of Scanning Electron Microscope Fe-Sem+Eds, E: Gnss Signal Simulation.
Start: 2025-06-02
End: 2025-06-17
Location: 国立大学法人

国立大学法人 Japan has Released a tender for A: A Set Of Ultrapure Water Manufacturing Equipment With High-Speed Large Area Electron Beam Exposure Device, B: Set Of Chip-To-Chip Interface Waveform Evaluation Equipment, C: Set Of Next-Generation Sequencer, D: Set Of Scanning Electron Microscope Fe-Sem+Eds, E: Gnss Signal Simulation. in laboratory equipment and services . The tender was released on Jun 02, 2025.

Country - Japan

Summary - A: A Set Of Ultrapure Water Manufacturing Equipment With High-Speed Large Area Electron Beam Exposure Device, B: Set Of Chip-To-Chip Interface Waveform Evaluation Equipment, C: Set Of Next-Generation Sequencer, D: Set Of Scanning Electron Microscope Fe-Sem+Eds, E: Gnss Signal Simulation.

Deadline - Jun 17, 2025

GT reference number - 110165707

Product classification - Laboratory, optical and precision equipments (excl. glasses)

Organization Details:

Address - Japan

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 110165707

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Bid announcementGeneral competitive bids are included as follows:June 2, 2025Fujii Teruo, President of the University of Tokyo◎Procurement agency number: 415 ◎Location number: 13○No. 71. Procurement details⑴ Item classification n umber 24⑵ Purchasing subject and quantityA: A set of ultrapure water manufacturing equipment with high-speed large area electron beam exposure deviceB: Chip-to-chip interface waveform evaluation device setC: Next Generation Sequencer SetD Scanning electron microscope FE-SEM+EDS setE GNSS signal simulator set⑶ Characteristics of the procurement subject, etc. according to the bidding instructions.⑷ Delivery deadline: For each subject in 1⑵

Gt Ref Id - 110165707

Deadline - Jun 17, 2025