Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Country - Finland
Summary - 8" Semi-Automatic Waffer Dicing Saw
Deadline - Aug 27, 2025
GT reference number - 113059451
Product classification - Laboratory, optical and precision equipments (excl. glasses)
Address - Finland
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 113059451
Document Type - Tender Notices
Description - Description: The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.The object of the tender process is described in more detail in the invitation to tender documents.local ti tle:: 8" Semi-Automatic Waffer Dicing SawContract Duration: : Kuukausissa 12Contract Type: : Supplylocal description: : The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.The object of the tender process is described in more detail in the invitation to tender documents.Tender URL: : https://tarjouspalvelu.fi/vtt?id=568546&tpk=f84c8dba-403d-45de-a2c4-29ec97898346
Gt Ref Id - 113059451
Deadline - Aug 27, 2025
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