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8" Semi-Automatic Waffer Dicing Saw

VTT Technical Research Centre of Finland Ltd Finland has Released a tender for 8" Semi-Automatic Waffer Dicing Saw in laboratory equipment and services . The tender was released on Jul 10, 2025.

Country - Finland

Summary - 8" Semi-Automatic Waffer Dicing Saw

Deadline - Aug 27, 2025

GT reference number - 113059451

Product classification - Laboratory, optical and precision equipments (excl. glasses)

Organization Details:

  Address - Finland

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 113059451

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.The object of the tender process is described in more detail in the invitation to tender documents.local ti tle:: 8" Semi-Automatic Waffer Dicing SawContract Duration: : Kuukausissa 12Contract Type: : Supplylocal description: : The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.The object of the tender process is described in more detail in the invitation to tender documents.Tender URL: : https://tarjouspalvelu.fi/vtt?id=568546&tpk=f84c8dba-403d-45de-a2c4-29ec97898346

Gt Ref Id - 113059451

Deadline - Aug 27, 2025

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