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30 Micron High Conducting Soi Wafer With 4 Micron Box

SOCIETY FOR INTEGRATED CIRCUIT TECHNOLOGY AND APPLIED RESEARCH BANGALORE India has Released a tender for 30 Micron High Conducting Soi Wafer With 4 Micron Box in Building. The tender was released on Apr 15, 2024.

Country - India

Summary - 30 Micron High Conducting Soi Wafer With 4 Micron Box

Deadline - login to view

GT reference number - 80789683

Product classification - Engineering works and construction works

Organization Details:

  Address - India

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 80789683

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: 30 Micron High Conducting Soi Wafer With 4 Micron Boxadditional_tender_url: https://eprocure.gov.in/epublish/app?page=FrontEndTenderDetailsExternal&service=page&tnid=1056481local title:: 30 MICRON HIGH CONDUCTING SOI wafer with 4 micron boxtype_of_procedure: Otherbidding_response_method: Not Available

Gt Ref Id - 80789683

Deadline - May 02, 2024

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