Summary:
Goods Specific Pure Phosphorus Oxychloride [Re-Tendering] [Change Procurement Method] - Single Source Announcement Release Date: 2024-04-18 Country:
China
Notice Type:
Tender Notice Deadline:
03 May 2024 Posting Date:
18 Apr 2024 |
Summary:
Nantong Kangyuan Integrated Circuit Packaging Carrier Board Project (Phase I) - 2 Automatic Film Tearing Machines - International Tender Announcement (1) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
16 Apr 2024 |
Summary:
International Bidding For Generator Outlet Circuit Breakers And Ancillary Equipment For Datang Jiangjin Gas Turbine Project - International Bidding Announcement (1) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
16 Apr 2024 |
Summary:
Enhanced Control Of Material Corrosion Interface [Hdly-Fw-Gkjt-24-0465] 1St Change Announcement Country:
China
Notice Type:
Tender Notice Deadline:
30 Apr 2024 Posting Date:
15 Apr 2024 |
Summary:
Nantong Kangyuan Integrated Circuit Packaging Carrier Board Project (Phase I) - 1 Plasma Machine [Re-Tender] - International Tender Announcement (2) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
15 Apr 2024 |
Summary:
Nantong Kangyuan Integrated Circuit Packaging Carrier Board Project (Phase I) - 1 Final Cleaning Machine [Re-Tender] - International Tender Announcement (2) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
15 Apr 2024 |
Summary:
Nantong Kangyuan Integrated Circuit Packaging Carrier Board Project (Phase I) - 1 Cnc Circuit Board Forming Machine [Re-Tender] - International Tender Announcement (2) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
15 Apr 2024 |
Summary:
Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
15 Apr 2024 |
Summary:
Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
15 Apr 2024 |
Summary:
Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1) Country:
China
Notice Type:
Tender Notice Deadline:
07 May 2024 Posting Date:
15 Apr 2024 |